1mm typ. 13.00mm [0.512"] 11.00mm [0.433"] 2.00mm [0.079"] 2.00mm [0.079"] 2.87mm [0.113"] 0.51mm [0.020"] c o n t a c t d a t a accepts 0.20mm - 0.33mm diameter pins 3-finger 37/25 gram, initial insertion force (with 0.254mm/0 .203mm dia. pin) 30/22 gram, normal force (with 0.254mm/0.203mm dia. pin) 20/17 gram, extraction force (with 0.254mm0.203mm d ia. pin) d e s c r i p t i o n : giga-snap bga smt foot 80 position (1.0mm pitch) gold plated female recept acle pins to smt solder balls (bga type). pin asign ment 1:1. status: released drawing: h. hansen scale: 6:1 rev: b date: 11/28/05 modified: 1/5/06 file: SF-BGA80F-B-42 dwg SF-BGA80F-B-42(f) drawing ? 2005 ironwood electronics, inc. po box21151 st. paul, mn 55121 tele: (651) 452-8100 www.ironwoodelectronics.com 1 substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material. (rohs) 2 1 top view side view pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). 3 contacts: beryllium copper alloy172, ht; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). patent pending 4 solder balls (see table above) t o l e r a n c e s : diameters 0.03mm [0.001"], pcb perimeters 0.18m m [0.007"], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005"] unless stated otherwise. materials and spec ifications are subject to change without notice. o r d e r i n g i n f o r m a t i o n : solder ball alloy part number suffix sn63pb37 *rohs compliant -42 sn96.5ag3.0cu0.5 -42f* 3 4 2 1 detail a detail a 1.33mm [0.052"] 2.36mm [0.093"]
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